UPSIREN UX PRO Ultra 50g jar High-viscosity nonconductive thermal putty for 24 mm gaps. Hand moldable compound for water cooling plates, desktop...
Newegg
5.0
1 review
Description
Engineered for water cooling and other big coolers: bridges coldplate tolerances that ordinary paste cant, delivering real contact to GDDR6/GDDR6X modules, VRM stages and controllers. High viscosity, hand moldable body lets you shape the layer exactly where needed; remains cohesive under pressure and resists pumpout during prolonged high-temperature operation. Creates a stable 24 mm interface across mixed height component clusters and around standoffs and frame edges, improving uniformity withou
SKU: 4458311258311462844930771