UPSIREN UX PRO Ultra 20g jar Max conductivity nonconductive thermal putty for 24 mm gaps. High viscosity, hand moldable compound for water cooling...
Newegg
5.0
1 review
Description
Water cooling ready: fills tolerances beneath cold plates where ordinary paste cannot hold a thermal path, delivering loop performance directly to GDDR6/GDDR6X modules, VRM stages and controllers across wide, uneven footprints. High viscosity, hand moldable body shapes to the exact zone you need, then stays put under pressure; resists pumpout and creep during extended high temperature operation in gaming, mining and AI systems. Ideal for large gaps: creates a stable 24 mm interface around stando
SKU: 445835169138792738585879