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UPSIREN UX PRO Ultra 20g jar Max conductivity nonconductive thermal putty for 24 mm gaps. High viscosity, hand moldable compound for water cooling...

UPSIREN UX PRO Ultra 20g jar Max conductivity nonconductive thermal putty for 24 mm gaps. High viscosity, hand moldable compound for water cooling...

$49.99 $59.9
₿ 0.00064
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Newegg
5.0
1 review

Description

Water cooling ready: fills tolerances beneath cold plates where ordinary paste cannot hold a thermal path, delivering loop performance directly to GDDR6/GDDR6X modules, VRM stages and controllers across wide, uneven footprints. High viscosity, hand moldable body shapes to the exact zone you need, then stays put under pressure; resists pumpout and creep during extended high temperature operation in gaming, mining and AI systems. Ideal for large gaps: creates a stable 24 mm interface around stando
SKU: 445835169138792738585879