UPSIREN U6 PRO 50g jar Thermal putty for thin heat sinks in gaming laptops and compact systems. Soft, lightly tacky compound for tight layouts;...
Newegg
5.0
1 review
Description
Built for thin form factor cooling in laptops and compact devices: fills microgaps and maintains shape under clamp pressure to stabilize contact over GDDR6 VRAMs, VRM stages and controller chips. Packaging advantage 50 g jar: ideal mid bulk capacity for small shops and power users; decant small portions for microscope work and keep reserves sealed to maintain consistency. Soft, lightly tacky texture for easy placement and adjustment; smooths cleanly to avoid spillover in dense areas and keeps ne
SKU: 4458313232373193073500822