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UPSIREN U6 PRO 20g jar Thermal putty for thin heat sinks in gaming laptops and compact systems. Soft, lightly tacky putty that levels mixed...
Newegg
5.0
1 review
Description
Optimized for thin formfactor cooling: spreads into microgaps and maintains shape under clamp force to enhance contact over GDDR6 VRAMs, VRM stages and hot controller chips. Packaging advantage 20 g jar: balanced quantity for repeat benches or multiple devices; easy to decant small portions for microscope work while keeping the main jar sealed between jobs. Soft, lightly tacky consistency that is easy to place and adjust; adheres gently during assembly but smooths cleanly to avoid spillover on d
SKU: 4458315461937126253875045
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