BTC
ETH
LTC
BCH
DOGE
USDT
DASH
XRP
USDC
XMR
BNB
TRX
SHIB
DAI
ZEC
SOL
ETC
POL
XLM
ADA
UPSIREN U6 PRO 10g jar Thermal putty for thin heat sinks in gaming laptops and slim consoles. Soft, lightly tacky thermal putty that levels mixed...
Newegg
5.0
1 review
Description
Purpose built for thin form factor cooling: wicks into micro gaps and holds shape under clamp pressure, helping low profile heat sinks move heat away from GDDR6 VRAMs, VRM stages and controller chips without relying on a perfect pad thickness. Packaging advantage 10 g jar: pocketable supply for single devices or short runs; reseals cleanly between steps and reduces waste while still servicing multiple components on a laptop mainboard. Soft, lightly tacky consistency that is easy to place and adj
SKU: 445835329301430739366904
Other products
