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UPSIREN U6 PRO 100g jar High-capacity thermal putty for thin heat sinks; 12.8 W/m·K*; nonconductive soft, lightly tacky compound optimized for ~12...
Newegg
5.0
1 review
Description
Designed for thin form factor cooling: conforms to microgaps and resists slump to enhance contact over GDDR6 VRAMs, VRM stages and other hot controllers in compact layouts. Packaging advantage 100 g jar: high capacity supply for labs and refurbishers; decant working amounts to maintain cleanliness and consistency across long, multidevice projects. Soft, lightly tacky body that stays put during assembly yet feathers cleanly; enables tidy edges and reliable reassembly on dense boards. Ideal perfor
SKU: 445836178830691706111972
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