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Liquid Metal by CSGR 1g 79 W/m·K* high performance thermal interface for CPU/GPU upgrades. Ultrahigh thermal conductivity compound for serious...
Newegg
5.0
1 review
Description
79 W/m·K* thermal conductivity drives exceptional heat transfer from dies and hotspots to copper/nickel coolers, enabling lower core and VRAM temperatures at the same acoustic profile or quieter fans at the same load. Compatible with K5 PRO® thermal putty: build a low-mess, nonconductive wall around the target area to help prevent migration and to fill any surrounding gaps or height variations for a controlled, professional finish. Precision, low-pressure application using the included plastic a
SKU: 4458318085887779359376342
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